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Tony Lucas, CEO of XCalibre and creator of FlexiScale, commented: Without this new ability to move swiftly and easily between platforms, customers could feel locked in and much more hesitant to try and use cloud computing RightScale s partnership initiative is a great example of how having near interoperability between systems will enable customers to be less hesitant of moving to a new technology, which is great for everyone It means the industry can and will grow quicker than if it was only a handful of individual companies providing distinct services that weren t compatible with each other GoGrid offers hosted cloud computing infrastructure that enables system administrators, developers, and IT professionals to create, deploy, and control load-balanced cloud servers and complex hosted virtual server networks GoGrid also delivers portal-controlled servers for Windows 2003 and 2008 and multiple Linux operating systems, and supports application environments like Ruby on Rails GoGrid is unique in cloud computing with the availability of 32-bit and 64-bit editions of Windows Server 2008, and was named winner of LinuxWorld 2008 Best of Show in August 2008 Cloud computing for the enterprise has arrived with the GoGrid and RightScale partnership, said GoGrid CEO, John Keagy Corporations now have few excuses not to, and multiple reasons to deploy and manage complex and redundant cloud infrastructures in real-time using the GoGrid, RightScale, and FlexiScale technologies Rackspace Hosting provides IT systems and computing-as-a-service to more than 33,000 customers worldwide Combining RightScale s technologies with Rackspace s focus on Fanatical Support will allow companies to focus more on their business and not spend a disproportionate amount of resources on IT demands

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into a liquid plastic and laid out to dry Both of these techniques, and more, are used to protect the circuit and to displace excess heat from the hybrid assembly A completed hybrid will take advantage of different circuit construction techniques, such as thin- and thick-film resistors (which can be printed and trimmed directly on the hybrid s substrate), SMD IC chips, SMD capacitors, flip-chips, trace coils, and microstrip transmission lines In fact, hybrid manufacture is basically a method of constructing a circuit on a specialized PCB by employing any desired electronics technology that is available so that we may decrease both the size and the cost of a circuit, while increasing reliability and performance Most of the actual ICs placed on a hybrid board are in their unpackaged form, even though many hybrids can and do use packaged SMD ICs But the ability to exploit ICs in their bare die form means that the size and cost of the entire hybrid circuit can be significantly improved The bare die is first attached to the hybrid PCB with an epoxy that is optimized for thermal conductivity and/or electrical conductivity, or the epoxy may insulate the bare chip both thermally and electrically from the PCB, depending on the application The chip s bond wires are attached to the hybrid PCB s metallization layer by a wire-bonding process This process will rely on the type of bonding wire used out of the bare die Gold wires require thermosonic bonding, while aluminum wire will need an ultrasonic procedure Both methods demand a special machine that utilizes a chiseled point that contacts the wire, pressing it against the board s surface metallization while vibrating at ultrasonic frequencies Thermosonic bonding for gold wires, as its name implies, also adds heat to this process A superior bare die attachment technique does not use wire bonding at all and obtains much decreased inductive effects Instead, small solder balls are attached to the IC s connection points The chip, now called a flip-chip, is affixed to the board by turning the IC chip over so that its solder balls are in contact with the pads of the board s metallization layer The entire assembly is then heated, causing the flip-chip to be permanently melded to the PCB, both mechanically and electrically There are other methods of attaching a bare die to a PCB, such as tape automatic bonding and adhesive-bonded microbumps For more detailed information on these processes, consult Hybrid Microelectronics Handbook by Sergent and Harper All of the other SMT components, such as the transistors, packaged RFICs, capacitors, resistors, and inductors, can be attached to the substrate s metallization layer by the reflow soldering process, which employs a solder paste that is printed onto the PCB and heated, causing the solder to reflow, electrically and mechanically connecting the components to the board.